D06-Data_Driven High_Entropy and Amorphous Materials
Symposium Introduction
In recent years, the exploration of high entropy alloys and amorphous materials, based on the order and disorder of materials from the perspective of chemical and topological aspects, has been rapidly advancing. As multi-element high-concentration alloy materials, understanding their specific structures and properties requires extensive data. Meanwhile, data science has become a crucial new paradigm for uncovering the relationship between "material composition – structure - performance".
Therefore, this conference will focus on the latest research progress in materials science and engineering, integrating data science with high entropy materials and amorphous alloys. It will also incorporate emerging processes such as 3D printing, injection molding, magnetron sputtering, and single crystal growth, along with simulation computing technologies like supercomputing, parallel computing, and cloud computing. By doing so, we aim to explore the performance and characteristics of materials under extreme conditions and service environments, address the key challenges and identify research directions. This conference will provide a platform for experts, scholars, engineers, technical R&D personnel, and enterprises in the field of materials science and engineering to share scientific research results and cutting-edge technologies, thus promoting the industrialization and cooperation of academic achievements. It is of great significance and urgency in the current development of these fields.
Symposium Topics
1.Microstructure and Properties of High Entropy Materials
2.Atomic level manufacturing of order and disorder in alloys
3.High Throughput calculations
4.Applications and processing of amorphous materials
5.Nano_level structure of metallic glasses and alloys
Symposium Organizers
|
Name |
Institution |
|
Chair |
Yong Zhang |
UST Beijing |
yongzhang@fyust.org.cn |
Co-chairs |
Peter K. Liaw |
UTK |
pliaw@utk.edu |
Hua Lei Zhang |
Xi’an Jiaotong University |
hualei@xjtu.edu.cn |
|
Wei Hua Wang |
Songshan Lake Laboratory |
whw@aphy.iphy.ac.cn |
|
Jun Wei Yeh |
National Tsing Hua U |
jwyeh@mx.nthu.edu.tw |
Organized by
UST Beijing
Supported by
UTK, Xi'an Jiaotong University,Songshan Lake Laboratory,Nationa TsingHua U
Contact with
Name: Jia Sheng Wang
Phone: +86-18035277089
Email: d202420018@xs.ustb.edu.cn
Institution: UST Beijing
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