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B04-Materials and devices for heterogeneous integration

Release time::2025-02-20 10:57 | Browse(49)Second

B04-Materials and devices for heterogeneous integration


Symposium Introduction

As the demand for advanced electronic systems continues to grow, the integration of diverse materials and devices has become a critical area of research and development. This symposium aims to bring together experts from academia, industry, and government to discuss the latest advancements and challenges in heterogeneous integration. By exploring innovative materials, novel device architectures, and cutting-edge fabrication techniques, we seek to pave the way for the next generation of high-performance, multifunctional systems.

Symposium Topics

1, Advanced Materials for Heterogeneous Integration
2,Innovative Device Architectures
3,Fabrication and Processing Techniques
4,Applications and System-Level Integration

Symposium Organizers 

Name

Institution

E-mail
Chair

Ye Zhou

Shenzhen University

yezhou@szu.edu.cn

Co-chairs  

Vellaisamy Arul Lenus Roy

Hong Kong Metropolitan University  

vroy@hkmu.edu.hk

Su-Ting Han

The Hong Kong Polytechnic University

suting.han@polyu.edu.hk

Meng Zhang

Shenzhen University

zhangmeng@szu.edu.cn

Qijun Sun

Guangdong University of Technology

qjsun@gdut.edu.cn

Xiaoguang Liang
Guangxi Normal University
lxg8521@gxnu.edu.cn

Organized by

Shenzhen University

Supported by

State Key Laboratory of Radio Frequency Heterogeneous Integration, Hong Kong Metropolitan University, The Hong Kong Polytechnic University, Guangdong University of Technology

Contact with

Name: Jingya Yang

Phone: +86-15014864206

Email: yangjingya@szu.edu.cn

Institution: Shenzhen University

















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